Thermal ManagementDesigned for use with motherboard heatsink or optional cooling armor
Operating Temperature Range0°C to 70°C – suitable for standard PC environments
Shock ResistanceRated up to 1500G/0.5ms – durable under physical stress
DimensionsStandard M.2 2280 size (22mm x 80mm)
ThicknessApprox. 2.25 mm (single-sided) – avoids interference with memory modules on compact boards
Weight~7g – lightweight and ideal for portable devices
Build MaterialsUses high-quality 3D NAND flash chips for long life and thermal stability
Thermal PerformanceCan be used with passive cooling solutions like heatsinks or heat spreaders
High Speed P C Ie Gen4 PerformanceUp to 5,000 MB/s read and 4,800 MB/s write speedsNearly double the bandwidth of PCIe Gen3 SSDs
Single Sided M.2 2280 Form FactorSlim and compact – fits most notebooks and small-form-factor desktop buildsNo interference with RAM slots
Modern N V Me 1.4 SupportEnhanced command handling, queue depth, and low-power modesOptimized for Windows 10/11 and Linux distributions
3 D N A N D TechnologyProvides higher density and endurance than traditional planar NANDOffers better performance over time with wear-leveling algorithms
Efficient Controller ArchitectureUses Innogrit or Phison controllers depending on batchDRAM-less models rely on HMB for virtual cache mapping
Plug and Play ReadyFully compatible with PCIe Gen4 and Gen3 M.2 slotsNo driver required – works natively in modern operating systems
Advanced Reliability ToolsBuilt-in S.M.A.R.T. for health monitoringSupports TRIM , LDPC error correction , and NCQ
highlightsDesigned For: Gamers, content creators, and professionals needing fast storage performance with broad compatibility,Use Case: Ideal for boot drives, game loading, video editing, and general system acceleration,Form Factor: Slim, single-sided M.2 2280 design fits laptops, ultrabooks, mini PCs, and desktop motherboards,Controller: Varies by model batch – typically uses Innogrit IG5220 or Phison E12/E19/E21 controllers,NAND Type: 3D NAND Flash – ensures durability, efficiency, and long-term reliability,Sequential Read Speed: Up to 5,000 MB/s,Sequential Write Speed: Up to 4,800 MB/s,Random Read IOPS: Up to 700,000 IOPS,Random Write IOPS: Up to 640,000 IOPS,Backward Compatibility: Works in PCIe Gen3 systems at reduced speeds (~3500 MB/s read),NVMe Protocol: Supports NVMe 1.4 for improved command queuing, power management, and drive optimization,DRAM-less Architecture: Utilizes Host Memory Buffer (HMB) via system RAM for cache when onboard DRAM is not included,Endurance (TBW): Approximately 700 TBW (Terabytes Written) – ideal for frequent read/write cycles,MTBF (Mean Time Between Failures): Over 2,000,000 hours – indicates strong long-term stability,Error Correction & Data Integrity:LDPC (Low-Density Parity-Check) ECC EngineS.M.A.R.T. monitoring supportTRIM commandNCQ (Native Command Queuing),LDPC (Low-Density Parity-Check) ECC Engine,S.M.A.R.T. monitoring support,TRIM command,NCQ (Native Command Queuing),Thermal Management: Designed for use with motherboard heatsink or optional cooling armor,Operating Temperature Range: 0°C to 70°C – suitable for standard PC environments,Shock Resistance: Rated up to 1500G/0.5ms – durable under physical stress,Dimensions: Standard M.2 2280 size (22mm x 80mm),Thickness: Approx. 2.25 mm (single-sided) – avoids interference with memory modules on compact boards,Weight: ~7g – lightweight and ideal for portable devices,Build Materials: Uses high-quality 3D NAND flash chips for long life and thermal stability,Thermal Performance: Can be used with passive cooling solutions like heatsinks or heat spreaders,High-Speed PCIe Gen4 Performance:Up to 5,000 MB/s read and 4,800 MB/s write speedsNearly double the bandwidth of PCIe Gen3 SSDs,Up to 5,000 MB/s read and 4,800 MB/s write speeds,Nearly double the bandwidth of PCIe Gen3 SSDs,Single-Sided M.2 2280 Form Factor:Slim and compact – fits most notebooks and small-form-factor desktop buildsNo interference with RAM slots,Slim and compact – fits most notebooks and small-form-factor desktop builds,No interference with RAM slots,Modern NVMe 1.4 Support:Enhanced command handling, queue depth, and low-power modesOptimized for Windows 10/11 and Linux distributions,Enhanced command handling, queue depth, and low-power modes,Optimized for Windows 10/11 and Linux distributions,3D NAND Technology:Provides higher density and endurance than traditional planar NANDOffers better performance over time with wear-leveling algorithms,Provides higher density and endurance than traditional planar NAND,Offers better performance over time with wear-leveling algorithms,Efficient Controller Architecture:Uses Innogrit or Phison controllers depending on batchDRAM-less models rely on HMB for virtual cache mapping,Uses Innogrit or Phison controllers depending on batch,DRAM-less models rely on HMB for virtual cache mapping,Plug-and-Play Ready:Fully compatible with PCIe Gen4 and Gen3 M.2 slotsNo driver required – works natively in modern operating systems,Fully compatible with PCIe Gen4 and Gen3 M.2 slots,No driver required – works natively in modern operating systems,Advanced Reliability Tools:Built-in S.M.A.R.T. for health monitoringSupports TRIM , LDPC error correction , and NCQ,Built-in S.M.A.R.T. for health monitoring,Supports TRIM , LDPC error correction , and NCQ
General Information Capacity32GB (1 x 32GB module)Memory Type: DDR4 SDRAMSpeed: 3200 MT/s (DDR4-3200 / PC4-25600)CAS Latency: CL16 (16-20-20 timing a..
12,500 E G P Ex Tax12,500 EGP
General Overview ModelTUF-GAMING-750BPower Output: 750W continuousTarget Use: Mid-range to high-end gaming PCs, workstation buildsForm Factor: Standa..
3,450 E G P 4,200 E G P Ex Tax3,450 EGP
General Information Designed ForHigh-performance cooling with visual customization for modern Intel and AMD CPUsUse Case: Ideal for gaming rigs, comp..
