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Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers

Name: Thermalright Heilos 40x60x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, 0.25mm Thickness, Gray Non-Conductive Silicone Sheet, Low Thermal Resistance 0.04 °C·cm²/W, High Resistivity 2.1×10¹⁴ Ω·cm, Compatible with CPU Coolers
Price: 999 EGP
Availability: InStock

999 EGP

El Badr Group

Updated: 6/29/2026

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Specifications

TypeSolid thermal interface pad (non-adhesive, pre-cut)

Use CaseDesigned for CPU, GPU, VRM, M.2 SSDs, and other heat-generating components

MaterialHigh-quality silicone-based compound with thermally conductive fillers

ColorGray

Form FactorPre-cut sheet for easy installation

DimensionsLength: 40 mmWidth: 60 mmThickness: 0.25 mm

Length40 mm

Width60 mm

Thickness0.25 mm

Thermal Conductivity8.5 W/m·K – delivers efficient heat transfer for modern processors

Thermal Resistance0.04 °C·cm²/W – ensures minimal thermal bottleneck between component and heatsink

ApplicationIdeal for use with air coolers, AIO liquid coolers, and passive cooling systems

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Temperature StabilityOperates reliably across standard PC thermal ranges

DurabilityLong-lasting performance without drying out or requiring reapplication

Electrical Resistivity2.1 × 10¹⁴ Ω·cm – highly non-conductive

Electrical IsolationYes – safe for use on sensitive electronics without risk of short circuits

Corrosion ResistanceNon-corrosive formula – protects PCB and surrounding components

Handling SafetyHarmless to skin and components – no toxic or reactive materials used

Material TypeSolid-phase thermal pad (not paste-based) – ideal for gap filling and even pressure distribution

Installation MethodDrop-in replacement or supplementary to thermal paste

Mounting PressureWorks best under moderate pressure from cooler mounting systems

Use WithStock or aftermarket CPU/GPU coolersMemory modules with direct-contact heatsinksM.2 SSDs and VRMs

highlightsType: Solid thermal interface pad (non-adhesive, pre-cut),Use Case: Designed for CPU, GPU, VRM, M.2 SSDs, and other heat-generating components,Material: High-quality silicone-based compound with thermally conductive fillers,Color: Gray,Form Factor: Pre-cut sheet for easy installation,Dimensions:Length: 40 mmWidth: 60 mmThickness: 0.25 mm,Length: 40 mm,Width: 60 mm,Thickness: 0.25 mm,Thermal Conductivity: 8.5 W/m·K – delivers efficient heat transfer for modern processors,Thermal Resistance: 0.04 °C·cm²/W – ensures minimal thermal bottleneck between component and heatsink,Application: Ideal for use with air coolers, AIO liquid coolers, and passive cooling systems,Temperature Stability: Operates reliably across standard PC thermal ranges,Durability: Long-lasting performance without drying out or requiring reapplication,Electrical Resistivity: 2.1 × 10¹⁴ Ω·cm – highly non-conductive,Electrical Isolation: Yes – safe for use on sensitive electronics without risk of short circuits,Corrosion Resistance: Non-corrosive formula – protects PCB and surrounding components,Handling Safety: Harmless to skin and components – no toxic or reactive materials used,Material Type: Solid-phase thermal pad (not paste-based) – ideal for gap filling and even pressure distribution,Installation Method: Drop-in replacement or supplementary to thermal paste,Mounting Pressure: Works best under moderate pressure from cooler mounting systems,Use With:Stock or aftermarket CPU/GPU coolersMemory modules with direct-contact heatsinksM.2 SSDs and VRMs,Stock or aftermarket CPU/GPU coolers,Memory modules with direct-contact heatsinks,M.2 SSDs and VRMs