COOLERIn Stock
Thermal Grizzly Minus Pad 8, 100×100×2.0 mm, High‑Performance Thermal Pad — pink, electrically insulating (8 kV/mm ASTM D149), Shore 00‑60, V‑0 flammability, operating −100°C to +250°C; high thermal conductivity, high compressibility, RoHS compliant.
1,500 EGP
El Badr Group
Updated: 6/29/2026
Specifications
Dimensions and format100 × 100 × 2.0 mm single sheet; pink for easy identification in assemblies.
Material and performanceCeramic‑silicone composite filled with nano aluminum oxide, delivering high thermal conductivity with high compressibility to conform over uneven surfaces and reduce contact resistance.
Electrical insulationDielectric strength rated 8 kV/mm per ASTM D149, appropriate for VRMs, memory, SSD controllers, GPU backplates, and other sensitive areas.
HardnessShore 00‑60, very soft and compliant for effective sealing under low mounting pressure.
Operating temperature−100°C to +250°C for reliable performance from sub‑zero to sustained high‑heat environments.
Flammability and complianceUL94 V‑0 flame rating; RoHS compliant materials and production.
Typical conductivity listingCommonly referenced at 8 W/m·K for Minus Pad 8 series, aligning with the “8” designation.
Use casesSuited to moderate standoff gaps where 1.0–1.5 mm is insufficient, such as GPU backplates, VRM heatsinks, and console/PC modules with larger tolerances.
highlightsDimensions and format: 100 × 100 × 2.0 mm single sheet; pink for easy identification in assemblies.,Material and performance: Ceramic‑silicone composite filled with nano aluminum oxide, delivering high thermal conductivity with high compressibility to conform over uneven surfaces and reduce contact resistance.,Electrical insulation: Dielectric strength rated 8 kV/mm per ASTM D149, appropriate for VRMs, memory, SSD controllers, GPU backplates, and other sensitive areas.,Hardness: Shore 00‑60, very soft and compliant for effective sealing under low mounting pressure.,Operating temperature: −100°C to +250°C for reliable performance from sub‑zero to sustained high‑heat environments.,Flammability and compliance: UL94 V‑0 flame rating; RoHS compliant materials and production.,Typical conductivity listing: Commonly referenced at 8 W/m·K for Minus Pad 8 series, aligning with the “8” designation.,Use cases: Suited to moderate standoff gaps where 1.0–1.5 mm is insufficient, such as GPU backplates, VRM heatsinks, and console/PC modules with larger tolerances.
Compare Prices
StorePriceStatus
