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Thermal Grizzly Kryonaut Thermal Paste, 1g syringe — non‑conductive (0 pS/m), density 3.7 g/cm³, viscosity 130–170 Pa·s, operating −250°C to +350°C, silver‑matt color; engineered for extreme overclocking with excellent thermal conductivity
425 EGP
El Badr Group
Updated: 6/29/2026
Specifications
Product1 g syringe; color: silver‑matt; intended for CPUs/GPUs and industrial cooling where maximum heat transfer is required.
Electrical propertiesElectrically non‑conductive at 0 pS/m, reducing short‑circuit risk around exposed SMDs and traces.
Physical propertiesDensity 3.7 g/cm33.7g/cm3; viscosity 130–170 Pa\cdotps130–170Pa\cdotps for stable application and gap filling of micro‑imperfections between IHS and cooler base.
Temperature rangeOperational from −250°C to +350°C, suitable for cryogenic benching up to sustained high‑temperature environments; carrier structure resists drying up to around 80°C in typical long‑term service.
Thermal performanceMarket listings commonly cite thermal conductivity around 12.5 W/m·K for this formulation, aligning with retailer and distributor specifications for the 1 g variant.
Application behaviorNo curing required; delivers peak performance immediately after application and maintains stability over time under normal operating conditions.
Use casesExtreme overclocking, high‑density workstations, and scenarios demanding excellent thermal interface performance without electrical conductivity risk; compatible with air and liquid coolers.
highlightsProduct: 1 g syringe; color: silver‑matt; intended for CPUs/GPUs and industrial cooling where maximum heat transfer is required.,Electrical properties: Electrically non‑conductive at 0 pS/m, reducing short‑circuit risk around exposed SMDs and traces.,Physical properties: Density 3.7 g/cm33.7g/cm3; viscosity 130–170 Pa\cdotps130–170Pa\cdotps for stable application and gap filling of micro‑imperfections between IHS and cooler base.,Temperature range: Operational from −250°C to +350°C, suitable for cryogenic benching up to sustained high‑temperature environments; carrier structure resists drying up to around 80°C in typical long‑term service.,Thermal performance: Market listings commonly cite thermal conductivity around 12.5 W/m·K for this formulation, aligning with retailer and distributor specifications for the 1 g variant.,Application behavior: No curing required; delivers peak performance immediately after application and maintains stability over time under normal operating conditions.,Use cases: Extreme overclocking, high‑density workstations, and scenarios demanding excellent thermal interface performance without electrical conductivity risk; compatible with air and liquid coolers.
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