highlightsCores / Threads: 6 cores / 12 threads,Base Clock: 4.7 GHz,Max Boost Clock: Up to 5.3 GHz,Cache:L1 Cache: 384 KB (64 KB per core)L2 Cache: 6 MB (1 MB per core)L3 Cache: 32 MB (shared across all cores),L1 Cache: 384 KB (64 KB per core),L2 Cache: 6 MB (1 MB per core),L3 Cache: 32 MB (shared across all cores),Unlocked for Overclocking: Yes – supports Precision Boost Overdrive , Curve Optimizer , and Ryzen Master Utility,Default TDP: 105W,Max Operating Temperature (Tjmax): 95°C,Process Technology:CPU Cores: TSMC 5nm FinFETI/O Die: TSMC 6nm FinFET,CPU Cores: TSMC 5nm FinFET,I/O Die: TSMC 6nm FinFET,Memory Type: DDR5 (dual-channel support),Max Memory Speed: Up to DDR5-5200 MT/s (with overclocking via EXPO or manual tuning),Maximum Memory Capacity: 128GB,ECC Support: Yes (requires compatible motherboard),Supported Chipsets:X670EX670B650EB650A620,X670E,X670,B650E,B650,A620,PCIe Support: PCIe 5.0 with 24 CPU lanes,Integrated Graphics:AMD Radeon™ Graphics (for basic display output)Graphics Cores: 2Graphics Frequency: 2200 MHz,AMD Radeon™ Graphics (for basic display output),Graphics Cores: 2,Graphics Frequency: 2200 MHz,Precision Boost 2: Dynamic frequency scaling for optimal performance,AMD EXPO: Enhanced memory profile for DDR5 overclocking,Cooler Included: No – MPK version is bulk-packaged without a stock coolerRecommended Cooler: High-performance air or liquid cooling (due to high TDP and overclocking support),Recommended Cooler: High-performance air or liquid cooling (due to high TDP and overclocking support),Thermal Paste: Not included (apply premium thermal paste for best results),Operating Systems:Windows 10/11 64-bitRed Hat Enterprise Linux x86_64Ubuntu x86_64,Windows 10/11 64-bit,Red Hat Enterprise Linux x86_64,Ubuntu x86_64,Overclocking Tools:AMD Ryzen MasterBIOS-based tuning (via motherboard software),AMD Ryzen Master,BIOS-based tuning (via motherboard software),Chipset Compatibility:Designed for next-gen motherboards with X670/B650/A620 chipsetsSupports DDR5 memory and PCIe 5.0 graphics cards,Designed for next-gen motherboards with X670/B650/A620 chipsets,Supports DDR5 memory and PCIe 5.0 graphics cards,Die Size:CPU Die: 71 mm²I/O Die: 122 mm²,CPU Die: 71 mm²,I/O Die: 122 mm²,Transistor Count: 6.57 billion,Package Type: MPK (Multi-Pack) – typically sold in bulk to system integrators or retailers; may not include retail accessories,Socket Compatibility:AM5 – supports up to DDR5 and PCIe 5.0Compatible with upcoming X870/X870E and B650 chipset motherboards,AM5 – supports up to DDR5 and PCIe 5.0,Compatible with upcoming X870/X870E and B650 chipset motherboards
