Dimensions and format120 × 20 × 3.0 mm, single piece; color pink for easy identification in assemblies.
Material and performanceCeramic‑silicone matrix with nano aluminum oxide for consistent heat transfer; engineered to compress easily for low contact resistance over uneven surfaces.
Electrical insulationRated 8 kV/mm dielectric strength per ASTM D149, providing safe use around sensitive components without risk of shorting.
HardnessShore 00‑60 for a very soft, compliant interface that conforms under light mounting pressure.
Flammability and complianceUL94 V‑0 flame rating; RoHS compliant and eco‑friendly production.
Operating temperature−100°C to +250°C for stability from sub‑zero to high‑heat environments; some retailer listings cite +200°C, but the manufacturer datasheet specifies up to +250°C for Minus Pad 8.
Thermal conductivityCommonly specified as 8 W/m·K in product data and retailer listings, matching the “8” designation in the series name.
Series contextMinus Pad 8 is available in 30×30, 120×20, and 100×100 mm sizes and 0.5/1.0/1.5/2.0/3.0 mm thicknesses; this SKU is the 3.0 mm strip variant suited to larger gaps like GPU backplates or tall VRM components.
highlights