Dimensions100 × 100 × 3.0 mm; single sheet, pink for easy identification.
Material/performanceCeramic‑silicone matrix with nano aluminum oxide, delivering high thermal conductivity and high compressibility to conform over uneven surfaces and reduce contact resistance.
Electrical insulationDielectric strength 8 kV/mm per ASTM D149, suitable for use around VRMs, memory, SSD controllers, GPU backplates, and other sensitive components.
HardnessShore 00‑60, very soft and compliant for effective sealing under low mounting pressure.
Operating temperature−100°C to +250°C for reliable performance from sub‑zero to sustained high‑heat environments.
Flammability/complianceUL94 V‑0 flame rating; RoHS compliant.
Typical thermal conductivityCommonly listed at 8 W/m·K for Minus Pad 8 series, aligning with the “8” designation.
highlightsDimensions: 100 × 100 × 3.0 mm; single sheet, pink for easy identification.,Material/performance: Ceramic‑silicone matrix with nano aluminum oxide, delivering high thermal conductivity and high compressibility to conform over uneven surfaces and reduce contact resistance.,Electrical insulation: Dielectric strength 8 kV/mm per ASTM D149, suitable for use around VRMs, memory, SSD controllers, GPU backplates, and other sensitive components.,Hardness: Shore 00‑60, very soft and compliant for effective sealing under low mounting pressure.,Operating temperature: −100°C to +250°C for reliable performance from sub‑zero to sustained high‑heat environments.,Flammability/compliance: UL94 V‑0 flame rating; RoHS compliant.,Typical thermal conductivity: Commonly listed at 8 W/m·K for Minus Pad 8 series, aligning with the “8” designation.