Dimensions and format100 × 100 × 1.5 mm single sheet; pink color for easy identification in assemblies.
Material and performanceCeramic‑silicone composite with nano Al₂O₃, offering high thermal conductivity and high compressibility to minimize contact resistance across component height variations.
Electrical insulationDielectric strength 8 kV/mm per ASTM D149, appropriate for VRMs, memory, SSD controllers, and GPU backplates where short‑circuit protection is essential.
HardnessShore 00‑60, very soft and compliant to achieve effective sealing under low mounting pressure and tight tolerances.
Operating temperature−100°C to +250°C for stable performance from sub‑zero to high‑heat environments in PCs and electronics.
Flammability and complianceUL94 V‑0 flammability rating; RoHS compliant and eco‑friendly production.
Thermal conductivityCommonly listed at 8 W/m·K for Minus Pad 8 series, aligning with the product designation and typical retailer/datasheet specs.
Series contextMinus Pad 8 is offered in 30×30, 120×20, and 100×100 mm formats and 0.5/1.0/1.5/2.0/3.0 mm thicknesses; this SKU is the large 1.5 mm sheet suited to cutting custom pieces for backplates, VRMs, and modules with moderate standoff gaps.