Dimensions and format100 × 100 × 0.5 mm; single sheet; pink color for easy identification in assemblies.
Material and performanceCeramic‑silicone matrix with nano aluminum oxide, providing high thermal conductivity and high compressibility to conform to uneven surfaces and minimize contact resistance.
Electrical insulationDielectric strength 8 kV/mm per ASTM D149, suitable around VRMs, memory, SSD controllers, and GPU backplates where short‑circuit protection is critical.
HardnessShore 00‑60, very soft and compliant for effective sealing under low mounting pressure and tight tolerances.
Operating temperature−100°C to +250°C, ensuring stability from sub‑zero to high‑heat environments in PCs and electronics.
Flammability and complianceUL94 V‑0 flame rating; RoHS compliant and eco‑friendly production.
Thermal conductivityCommonly specified at 8 W/m·K for Minus Pad 8 series, aligning with the product designation.
Series contextMinus Pad 8 is available in 30×30, 120×20, and 100×100 mm sizes and 0.5/1.0/1.5/2.0/3.0 mm thicknesses; this SKU is the large 0.5 mm sheet suited to cutting custom shapes for M.2, VRM, RAM, and backplate applications with very tight gaps.
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