X M P 3.0 ProfileDelivers DDR5-6000 performance at 1.4V with tight CL30 (30-36-36) timings for high-speed stability
J E D E C Default ProfilePre-programmed for DDR5-4800 at 40-39-39 and 1.1V for maximum compatibility across systems
On Die E C C ( O D E C C)Enhances data integrity and system reliability at elevated speeds
Optimized for Gaming & OverclockingDesigned for use in enthusiast builds and high-performance desktops
Infrared Sync TechnologyAllows synchronized lighting across multiple modules without direct connections
Low Profile HeatspreaderBlack base with RGB highlights – ideal for builds with limited RAM clearance
Premium Build QualityDurable construction with thermal management to support sustained performance
Motherboard CompatibilityWorks with Intel platforms that support DDR5 and XMP 3.0
Supported C P UsCompatible with 12th Gen (Alder Lake), 13th Gen (Raptor Lake), and future compatible Intel processors
R A M ClearanceFits under most modern CPU coolers, including low-profile and mid-tall RAM-compatible models
Channel ConfigurationsSingle-channel (1x16GB)Dual-channel (2x16GB) – recommended for optimal performance
Rank Configuration1Rx8 (Single Rank)
Pin Count288-pin DIMM
Timing ( X M P 3.0)30-36-36
Timing ( J E D E C)40-39-39
ControllerIntegrated ODECC for improved reliability
Software SupportKingston FURY CTRL for RGB customization, monitoring, and tuning
highlightsModel Number : KF560C30BBA/16,Capacity : 16GB (1 x 16GB module),Memory Type : DDR5 SDRAM,Speed/Data Rate : 6000 MT/s (PC5-48000),CAS Latency (CL) : CL30 (30-36-36),Voltage :XMP 3.0 profile : 1.4VJEDEC default profile : 1.1V (DDR5-4800 at 40-39-39),XMP 3.0 profile : 1.4V,JEDEC default profile : 1.1V (DDR5-4800 at 40-39-39),Module Configuration : 1Rx8 (Single Rank),Form Factor : 288-pin DIMM,RGB Lighting : Yes, with customizable effects,Heat Spreader : Low-profile black with RGB accents,Intel XMP Support : Yes (XMP 3.0),AMD EXPO Support : No,ECC : On-die ECC (ODECC) for improved stability,Operating Temperature : 0°C to 85°C,Storage Temperature : -55°C to 100°C,Dimensions : 133.35 x 41.1 x 8.2 mm,XMP 3.0 Profile : Delivers DDR5-6000 performance at 1.4V with tight CL30 (30-36-36) timings for high-speed stability,JEDEC Default Profile : Pre-programmed for DDR5-4800 at 40-39-39 and 1.1V for maximum compatibility across systems,On-Die ECC (ODECC) : Enhances data integrity and system reliability at elevated speeds,Optimized for Gaming & Overclocking : Designed for use in enthusiast builds and high-performance desktops,RGB Lighting : Fully customizable via Kingston FURY CTRL software or motherboard control interfaces,Infrared Sync Technology : Allows synchronized lighting across multiple modules without direct connections,Low-Profile Heatspreader : Black base with RGB highlights – ideal for builds with limited RAM clearance,Premium Build Quality : Durable construction with thermal management to support sustained performance,Motherboard Compatibility : Works with Intel platforms that support DDR5 and XMP 3.0,Supported CPUs : Compatible with 12th Gen (Alder Lake), 13th Gen (Raptor Lake), and future compatible Intel processors,RAM Clearance : Fits under most modern CPU coolers, including low-profile and mid-tall RAM-compatible models,Channel Configurations :Single-channel (1x16GB)Dual-channel (2x16GB) – recommended for optimal performance,Single-channel (1x16GB),Dual-channel (2x16GB) – recommended for optimal performance,Rank Configuration : 1Rx8 (Single Rank),Pin Count : 288-pin DIMM,Timing (XMP 3.0) : 30-36-36,Timing (JEDEC) : 40-39-39,Controller : Integrated ODECC for improved reliability,Software Support : Kingston FURY CTRL for RGB customization, monitoring, and tuning
Compact S F X Form FactorReady to power the world’s best small form factor PCs.80 PLUS Platinum Certified: For ultra-high efficiency operationZero RPM..
7,000 E G P Ex Tax7,000 EGP
Case Specifications Form FactorMid TowerMotherboard Type: Mini ITX / Micro ATXColor: BlackMaterials: Steel, Plastic, GlassDimensionsSize: H = 450 mm,..
2,100 E G P Ex Tax2,100 EGP
General Specifications NameAMD Ryzen™ 5 8400FFamily: RyzenSeries: Ryzen 8000 SeriesForm Factor: DesktopsArchitecture: Zen 4Process Technology: TSMC 4..
5,799 E G P Ex Tax5,799 EGP
General Information Capacity1TBForm Factor: M.2 2280 (80.15mm x 22.15mm x 2.38mm)Interface: PCIe Gen4 x4Controller: Not explicitly stated (assumed to..
7,099 E G P 7,500 E G P Ex Tax7,099 EGP
80 Plus RatingGOLDATX Version:ATX 3.1Protections:OVP / OPP / SCP / OCP / UVP / OTP / NLO / SIPCertification:CB/TUV/cTUVus/CE+UKCA/FCC+IC/LVD+UKCA/BSM..
